This system is good for various types of lead frames and wide lead frame size. This system is also suitable for Power Device. Trouble-less and provides high performance.
This system is good for high density substrates. Flash-less molding by the individual cavity bar adjustment function. Adopts various package production.
This system is good for development & small volume of production. Low cost & Super-compact. You can choose semi-auto or full auto.
Direct inject molding from top package and brings best quality. The center mold circulation method, which is the very first technique in the industry achieves high efficiency. This system is also efficient for a replacement of potting machine.
Reel to Reel system. It gives you a high performance with 13 seconds of machine time. Low cost and super compact.
This system is good for mass production of reel type products. Trouble-less and gives you high performance & superior maintainability. Offers you many kinds press variations.
This system is good for POP/Side Gate BGA/High density substrates. Flash-less molding by the individual cavity bar adjustment function. Adopts various package production.
This system is good for QFN or BGA substrates with thin package thickness. Its moving cavity function (Patented) enables you to change package thickness within certain range. In addition, it does not require any special type of compound such as liquid or granular.
This system is equipped with film assist feature as standard and good for QFN and pre-taped QFN packages. In addition, it can also be used for normal lead frame by conversion.
Our sintering method uses high pressure and high temperature. You can select the number of press to meet your production from small to large production volume. Our unique individual floating function absorb the different height of chip and provide the high quality.