COSMO-T Series

Specification

System Model COSMO-T Series

Press count 1, 2, 3 or 4press

Strip count Max 8strip/system, 2strip/press

Clamp force 80ton, 120ton, 180ton or 240ton

Transfer force Max 5.0ton

Frame size Max 100*300mm

Features ✓ Basic machine capable of handling various products. ✓ Capable of handling very large frames, such as matrix frames.

Material Lead frames and substrates

Magazine Slit type or Stack type

Plunger method Hydraulic or Spring

Auto/Manual Fully-Automatic or Manual

Options

  • *Frame identification image sensor
  • *Vacuum molding
  • *Image inspection
  • *Retractable pins
  • *Heat sink carrier available
  • *Absorption mechanism for heat sink thickness variation
  • *Traceability
  • *Gate cut
  • *SECS/GEM

Items marked with * are optional.

COSMO-T Series

COSMO-T Series

Standard semiconductor molding equipment for small-volume and large-volume production.

Mold clamping force ranges from 80ton to a maximum of 240ton for a wide variety of products.

Suitable for molding leadframes and can be used for a wide range of products including DIP, QFN, QFP, TO, SOP (SOIC), SON, SOT and power module packages.

Vacuum molding, and retractable pins to control resin bleed on heat sinks of power semiconductors are available as options.

Exposed molding of heat sinks for power semiconductors used in automotive, consumer and industrial applications.

A heat sink carrier and absorption of thickness variation of heat sinks are available

Gate cutting after molding is available as an option.

Hydraulic plunger absorbs resin volume variation and apply same package pressure wihout being affected by resin volume variation.

Spring plunger with an optional load cell can control the package pressure.

An optional post-molding image inspection function is available to detect resin bleed, chips, stains and more.

A fully automatic system for large-volume production or a manual system for development and evaluation can be selected.