System Model COSMO-TFA Series
Specification
Press count 1, 2, 3 or 4press
Strip count Max 8strip/system, 2 strip/press
Clamp force 80ton or 120ton
Transfer force Max 3.0ton
Frame size Max 100*300mm
Features
✓ Capable of ultra-thin packages
✓ Film assist mechanism
✓ Capable of various packages
Material Lead frames and substrates
Magazine Slit type or Stack type
Plunger method Hydraulic or Spring
Auto/Manual Fully-Automatic or Manual
Options
- *Frame identification image sensor
- *Vacuum molding
- *Image inspection
- *Traceability
- *SECS/GEM
Items marked with * are optional.
COSMO-TFA Series
Semiconductor encapsulation equipment with a film assist function, suitable for large-volume production.
The film assist mechanism helps reduce resin bleeds when exposing frames or heat sinks.
The film assist function supports all patterns: top only, bottom only or both sides.
Clamp force can be selected from 80ton to 120ton, suitable for a wide variety of products.
Suitable for molding leadframes and can be used for a wide range of products including QFP, QFN, SON, PLCC and power module packages.
Disabling the film function, QFN pre-taped package can be molded.
By adopting a high vacuum molding pump as an option, voids are reduced.
An optional post-molding image inspection function is available to detect resin bleeds, chips, stains and more.
Hydraulic plunger absorbs resin volume variation and apply same package pressure wihout being affected by resin volume variation.
A fully automatic system for large-volume production or a manual system for development and evaluation can be selected.