System Model COSMO-TFlex Series
Specification
Press count 1, 2, 3 or 4press
Strip count Max 8strip/system, 2strip/press
Clamp force 80ton or 120ton
Transfer force Max 3.0ton
Frame size Max 100*300mm
Features
✓ Capable of ultra-thin packages
✓ Film assist mechanism
✓ Package thickness can be adjusted as needed
✓ Package thickness inspection mechanism
✓ Capable of various packages
✓ Vacuum molding
Material Lead frames and substrates
Magazine Slit type or Stack type
Plunger method Hydraulic
Auto/Manual Fully-Automatic or Manual
Options
- *Frame identification image sensor
- *Image inspection
- *Traceability
- *SECS/GEM
Items marked with * are optional.
COSMO-TFlex Series
A semiconductor molding system with a film assist function, capable of flexible thickness adjustment and suitable for large-volume production.
Package thickness can be adjusted as needed, allowing for products with different thicknesses without changing the mold tools.
The film assist mechanism helps reduce resin bleeds when exposing frames or heat sinks.
Clamp force can be selected from 80ton to 120ton, suitable for a wide variety of products.
Suitable for molding leadframes and can be used for a wide range of package including BGA, QFN, LGA and power module package.
Disabling the film function, QFN pre-taped package can be molded.
Unique floating design allows suppression of resin bleeds in double-sided exposed molding.
By adopting a high vacuum molding pump as an option, voids are reduced.
An optional post-molding image inspection function is available to detect resin bleeds, chips, stains and more.
Hydraulic plunger absorbs resin volume variation and apply same package pressure wihout being affected by resin volume variation.
A fully automatic system for large-volume production or a manual system for development and evaluation can be selected.