System Model COSMO-WBGA Series
Specification
Press count 1, 2, 3 or 4press
Strip count Max 8 strip/system, 2 strip/press
Clamp forces 80ton
Transfer force Max 3.5ton
Frame size Max 80*260mm
Features
✓ The "Cavity Adjuster" special mechanism enables flashless molding.
✓ Capable of various packages
Material Substrates
Magazine Slit type or Stack type
Plunger method Hydraulic or Spring
Auto/Manual Fully-Automatic or Manual
Options
- *Frame identification image sensor
- *Vacuum molding
- *Image inspection
- *Traceability
- *SECS/GEM
Items marked with * are optional.
COSMO-WBGA Series
Semiconductor molding equipment suitable for substrate products, from small-volume to large-volume production.
Quick and easy package type conversion.
Capable of molding of substrate products including SiP, PBGA and FCBGA.
The mechanism that absorbs thickness variations maintains proper clamp pressure on the substrate and prevents resin bleeding and cracks.
By adopting a high vacuum molding pump as an option, voids are suppressed.
Hydraulic plunger absorbs resin volume variation and apply same package pressure wihout being affected by resin volume variation.
Spring plunger with an optional load cell can control the package pressure.
An optional post-molding image inspection function is available to detect resin bleeds, chips, stains and more.
A fully automatic system for large-volume production or a manual system for development and evaluation can be selected.