COSMO-WBP Series

Specification

^{System Model} COSMO-WBP Series

^{Press count} 1, 2 or 3press

^{Strip count} Max 6strip/system, 2strip/press

^{Clamp force} 80ton

^{Transfer force} Max 3.5ton

^{Frame size} 80*260mm (75*240mm)

( ) is for Top gate molding

^Features ✓ Suitable for PoP(Package on Package) products and side gate BGA products.
✓ The "Cavity Adjuster" special mechanism helps reduce flash.
✓ Capable of various packages

^Material Substrates

^Magazine Slit type or Stack type

^{Plunger method} Hydraulic or Spring

^Auto/Manual Fully-Automatic or Manual

^Options

*Frame identification image sensor
*Vacuum molding
*Image inspection
*Traceability
*SECS/GEM

Items marked with * are optional.

COSMO-WBP Series

Semiconductor molding system compatible with both side-gate and top-gate molding

Supports molding of substrates.

Injecting resin from the center of the package effectively reduces voids and wire sweep.

Ideal for products where side gates cannot be applied.

Conversion allows compatibility with side-gate molding.

The mechanism that absorbs thickness variations maintains proper clamp pressure on the substrate and prevents resin bleeding and cracks.

By adopting a high vacuum molding pump as an option, voids are reduced.

Hydraulic plunger absorbs resin volume variation and apply same package pressure without being affected by resin volume variation.

Spring plunger with an optional load cell can control the package pressure.

A fully automatic system for large-volume production or a manual system for development and evaluation can be selected.